Experimental Design Considerations for Accelerated Life Tests with Nonlinear Constraints and Censoring
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[1] Loon Ching Tang,et al. Planning accelerated life tests for censored two‐parameter exponential distributions , 1999 .
[2] Keith C. Norris,et al. Reliability of controlled collapse interconnections , 1969 .
[3] L. Tang,et al. Planning multiple levels constant stress accelerated life tests , 2002, Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318).
[4] Robert Darveaux,et al. Solder Joint Fatigue Life Model , 1997 .
[5] Huairui Guo,et al. D-optimal reliability test design for two-stress accelerated life tests , 2007, 2007 IEEE International Conference on Industrial Engineering and Engineering Management.
[6] L. Coffin,et al. A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal , 1954, Journal of Fluids Engineering.
[7] Nicholas P. Mencinger,et al. A Mechanism-Based Methodology for Processor Package Reliability Assessments , 2000 .
[8] Elsayed A. Elsayed,et al. Optimum Accelerated Life Testing Plans Based on Proportional Mean Residual Life , 2005 .
[9] William Q. Meeker,et al. Planning accelerated life tests with two or more experimental factors , 1995 .
[10] W. Engelmaier,et al. Functional Cycles and Surface Mounting Attachment Reliability , 1985 .
[11] S. Manson. Behavior of materials under conditions of thermal stress , 1953 .
[12] P. Chan,et al. Optimal sample size allocation for tests with multiple levels of stress with extreme value regression , 2007 .
[13] Shalabh Tandon,et al. Understanding the effect of dwell time on fatigue life of packages using thermal shock and intrinsic material behavior , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[14] Bong-Jin Yum,et al. Optimal design of accelerated life tests with two stresses , 1996 .
[15] Arzu Onar,et al. A penalized local D-optimality approach to design for accelerated test models , 2004 .
[16] Ahmer Syed,et al. Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).