Experimental Design Considerations for Accelerated Life Tests with Nonlinear Constraints and Censoring

Problem: As the electronic industry has adopted lead-free solder joint technology, the failure acceleration model for solder joint fatigue needs to be reinvestigated through accelerated life tests (ALT). However, traditional ALT designs currently employed by the industry fail to provide sufficient information for this purpose. Approach: This paper explores criteria for effectively planning ALT. It addresses the problem by hypothesizing a model form, deriving the model parameters using real data, and simulating ALT results for different experimental design plans. Relative comparisons are drawn between the influence of experimental design selection and some traditional reliability test plan variables such as sample size, censoring scheme, and sample allocation. Results: We find that the importance of selecting an experimental design exceeds the importance usually given to the selection of sample size and censoring scheme, or to the choice of a test unit allocation strategy in the context of a reliability test case study. D-optimal—based designs provide good performance for acceleration model validation, especially when the testing feasibility region is asymmetric. D-optimal designs offer an eightfold reduction in sample size over legacy designs for a fixed precision. Alternatively, D-optimal designs yield a 3.5× increase in parameter estimate precision over legacy designs for a fixed sample size. Numerical simulations confirm that legacy designs provide insufficient precision to determine if two or three model parameters are significant.

[1]  Loon Ching Tang,et al.  Planning accelerated life tests for censored two‐parameter exponential distributions , 1999 .

[2]  Keith C. Norris,et al.  Reliability of controlled collapse interconnections , 1969 .

[3]  L. Tang,et al.  Planning multiple levels constant stress accelerated life tests , 2002, Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318).

[4]  Robert Darveaux,et al.  Solder Joint Fatigue Life Model , 1997 .

[5]  Huairui Guo,et al.  D-optimal reliability test design for two-stress accelerated life tests , 2007, 2007 IEEE International Conference on Industrial Engineering and Engineering Management.

[6]  L. Coffin,et al.  A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal , 1954, Journal of Fluids Engineering.

[7]  Nicholas P. Mencinger,et al.  A Mechanism-Based Methodology for Processor Package Reliability Assessments , 2000 .

[8]  Elsayed A. Elsayed,et al.  Optimum Accelerated Life Testing Plans Based on Proportional Mean Residual Life , 2005 .

[9]  William Q. Meeker,et al.  Planning accelerated life tests with two or more experimental factors , 1995 .

[10]  W. Engelmaier,et al.  Functional Cycles and Surface Mounting Attachment Reliability , 1985 .

[11]  S. Manson Behavior of materials under conditions of thermal stress , 1953 .

[12]  P. Chan,et al.  Optimal sample size allocation for tests with multiple levels of stress with extreme value regression , 2007 .

[13]  Shalabh Tandon,et al.  Understanding the effect of dwell time on fatigue life of packages using thermal shock and intrinsic material behavior , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[14]  Bong-Jin Yum,et al.  Optimal design of accelerated life tests with two stresses , 1996 .

[15]  Arzu Onar,et al.  A penalized local D-optimality approach to design for accelerated test models , 2004 .

[16]  Ahmer Syed,et al.  Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).