Natural-convection heat transfer enhancement of aluminum heat sink using nanocoating by electron beam method

The high power density and compactness of the next generation electronic devices necessitate efficient and effective cooling methods for heat dissipation in order to maintain the temperature at an acceptable safety level. In the present work, aluminum nanocoating was employed in a heat sink to study the heat transfer performance under natural-convection conditions. The nanocoating was achieved using an electron beam method while the characteristics of nanocoated surfaces were analysed using SEM, an energy dispersive X-ray spectroscopy, surface roughness profilometry equipment and by X-ray diffraction techniques. The heat dissipation from heat sink with and without nanocoating under natural-convection has been experimentally studied at different controllable surrounding temperatures. A uniform increase in the surface roughness by the nanocoating was seen in all cases. The conclusion from several experimental results was that the effect of nanocoating in augmenting the heat transfer is more pronounced only when there is a sufficient temperature driving potential.

[1]  K. E. Starner,et al.  Closure to “Discussion of ‘An Experimental Investigation of Free-Convection Heat Transfer From Rectangular-Fin Arrays’” (1963, ASME J. Heat Transfer, 85, p. 277) , 1963 .

[2]  Charles Dingee Jones,et al.  Optimum Arrangement of Rectangular Fins on Horizontal Surfaces for Free-Convection Heat Transfer , 1970 .

[3]  J. Sunderland,et al.  Natural convection from pin fin arrays , 1990 .

[4]  Michael Pecht,et al.  Handbook of Electronic Package Design , 1991 .

[5]  Michael Pecht,et al.  Junction temperature considerations in evaluating electronic parts for use outside manufacturers-specified temperature ranges , 2001 .

[6]  K. E. Morgan,et al.  Fabrication of native, single‐crystal AlN substrates , 2003 .

[7]  C. Kobus,et al.  Development of a theoretical model for predicting the thermal performance characteristics of a vertical pin-fin array heat sink under combined forced and natural convection with impinging flow , 2005 .

[8]  R. Ricci,et al.  An experimental IR thermographic method for the evaluation of the heat transfer coefficient of liquid-cooled short pin fins arranged in line , 2006 .

[9]  P. Conway,et al.  Thermal Interface Materials - A Review of the State of the Art , 2006, 2006 1st Electronic Systemintegration Technology Conference.

[10]  F. Durst,et al.  Selection and optimization of pin cross-sections for electronics cooling , 2007 .

[11]  Y. Joshi,et al.  Single-Phase Forced Convection in Microchannels with Carbon Nanotubes for Electronics Cooling Applications , 2008 .

[12]  Hung-Yi Li,et al.  Measurement of performance of plate-fin heat sinks with cross flow cooling , 2009 .

[13]  Chen Li,et al.  THERMOHYDRAULIC CHARACTERISTICS OF A SINGLE-PHASE MICROCHANNEL HEAT SINK COATED WITH COPPER NANOWIRES , 2011 .

[14]  Z. Yao,et al.  Micro/nano hierarchical structure in microchannel heat sink for boiling enhancement , 2012, 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS).

[15]  M. Cheralathan,et al.  Experimental investigation on carbon nano tubes coated brass rectangular extended surfaces , 2013 .

[16]  R. Senthilkumar,et al.  Analysis of natural convective heat transfer of nano coated aluminium fins using Taguchi method , 2013 .

[17]  D. Mutharasu,et al.  Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink , 2014 .

[18]  A. A. Mehrizi,et al.  Thermal performance of an innovative heat sink using metallic foams and aluminum nanoparticles—Experimental study ☆ , 2015 .

[19]  S. Kim,et al.  Comparison of thermal performance between plate-fin and pin-fin heat sinks in natural convection , 2015 .

[20]  Minyu Ma,et al.  Fouling corrosion in aluminum heat exchangers , 2015 .