论文信息 - DARPA’s Intra/Interchip Enhanced Cooling (ICECool) Program

DARPA’s Intra/Interchip Enhanced Cooling (ICECool) Program

The Defense Advanced Research Projects Agency (DARPA) is pursuing research working toward a new paradigm of embedded cooling for thermal management of microelectronic devices. This work was initiated in the Near Junction Thermal Transport (NJTT) thrust, which is the transitional effort to an embedded cooling paradigm, building on the advanced remote cooling developed in the Thermal Management Technologies (TMT) program. The full implementation of embedded cooling is being pursued in the two efforts of the Intra/Interchip Enhanced Cooling (ICECool) program: ICECool Fundamentals and ICECool Applications.

[1] R. Pease,et al. High-performance heat sinking for VLSI , 1981, IEEE Electron Device Letters.

[2] J. Calame,et al. Simulations of direct-die-attached microchannel coolers for the thermal management of GaN-on-SiC microwave amplifiers , 2005, IEEE Transactions on Components and Packaging Technologies.

[3] A. Mosyak,et al. Fluid Flow, Heat Transfer and Boiling in Micro-Channels , 2008 .

[4] O. Litschke,et al. Highly integrated 8×8 antenna array demonstrator on LTCC with integrated RF circuitry and liquid cooling , 2010, Proceedings of the Fourth European Conference on Antennas and Propagation.

[5] Michael J. Ellsworth,et al. Thermal and mechanical analysis and design of the IBM Power 775 water cooled supercomputing central electronics complex , 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

[6] Avram Bar-Cohen,et al. Advanced thermal management technologies for defense electronics , 2012, Defense, Security, and Sensing.

[7] Avram Bar-Cohen,et al. Two-Phase Thermal Transport in Microgap Channels—Theory, Experimental Results, and Predictive Relations , 2012 .