Defect Migration of Multi-chip Modules Using Structural Test
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[1] John A. Nelson,et al. The Development of Unisys Multichip Modules , 1993 .
[2] Paul H. Bardell,et al. Production experience with built-in self-test in the IBM ES/9000 system , 1991, 1991, Proceedings. International Test Conference.
[3] William F. Washburn,et al. IBM Enterprise System/9000 Type 9121 Model 320 air-cooled processor technology , 1991, IBM J. Res. Dev..
[4] Sudha Sarma,et al. Enhanced self-test techniques for VLSI systems applied to the IBM Enterprise System/9000 Type 9121 processor , 1991, IBM J. Res. Dev..
[5] Bernd Könemann,et al. A Test Generation Methodology for High-Performance Computer Chips and Modules , 1992, Proceedings International Test Conference 1992.
[6] Leon L. Wu,et al. Physical and electrical design features of the IBM Enterprise System/9000 circuit module , 1992, IBM J. Res. Dev..