Ink for Ink-Jet Printing of Electrically Conductive Structures on Flexible Substrates with Low Thermal Resistance

The development of new technologies in electronics related to flexible polymeric substrates forces the industry to introduce suitable tools (special type of dispensers) and modern conductive materials for printing electronic circuits. Moreover, due to the wide use of inexpensive polymeric foils (polyethene, PE, or poly(ethylene terephthalate), PET), there is a need to develop materials with the lowest possible processing temperatures. The present paper presents the selection criteria of suitable components and their preparation for obtaining electrically conductive ink with a special nanosilver base. In the case of the discussed solution, all components allow to make circuits in relatively low sintering temperature (even below 130°C). Additionally, the authors show the most significant ink parameters that should be taken into consideration during Research and Development (R&D) works with electrically conductive inks. Moreover, ink stability parameters are discussed and some examples of printed circuits are presented.

[1]  Steve Lien-Chung Hsu,et al.  Synthesis of contamination-free silver nanoparticle suspensions for micro-interconnects , 2007 .

[2]  Jinping Zhou,et al.  Aqueous synthesis of silver nanoparticles stabilized by cationic cellulose and their catalytic and antibacterial activities , 2013 .

[3]  Noor Amalina Ramli,et al.  2016 17TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) , 2016, EuroSimE 2016.

[4]  Qi Zhang,et al.  Synthesis of silver nano particles and fabrication of aqueous Ag inks for inkjet printing , 2011 .

[5]  E. Halonen,et al.  Oven Sintering Process Optimization for Inkjet-Printed Ag Nanoparticle Ink , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[6]  Julien Bras,et al.  Infra-red assisted sintering of inkjet printed silver tracks on paper substrates , 2011 .

[7]  Jie Zhang,et al.  Fine-line conductor manufacturing using drop-on demand PZT printing technology , 2002 .

[8]  N. Toshima,et al.  Preparation of Colloidal Transition Metals in Polymers by Reduction with Alcohols or Ethers , 1979 .

[9]  K. Suganuma,et al.  Room-Temperature Sintering Process of Ag Nanoparticle Paste , 2009, IEEE Transactions on Components and Packaging Technologies.

[10]  Patrick J. Smith,et al.  Direct ink-jet printing and low temperature conversion of conductive silver patterns , 2006 .

[11]  F. Barreca,et al.  PMA capped silver nanoparticles produced by UV-enhanced chemical process , 2009 .

[12]  Bin Zhao,et al.  PVP Protective Mechanism of Ultrafine Silver Powder Synthesized by Chemical Reduction Processes , 1996 .

[13]  Young‐Chang Joo,et al.  Characteristics of microstructure and electrical resistivity of inkjet-printed nanoparticle silver films annealed under ambient air , 2008 .

[14]  Y. Liao,et al.  Formation of conductive silver films via inkjet reaction system , 2011 .

[15]  Ulrich S. Schubert,et al.  Alternative sintering methods compared to conventional thermal sintering for inkjet printed silver nanoparticle ink , 2014 .

[16]  U. Schubert,et al.  Inkjet Printing of Narrow Conductive Tracks on Untreated Polymeric Substrates , 2008 .

[17]  Sawyer B. Fuller,et al.  Ink-jet printed nanoparticle microelectromechanical systems , 2002 .

[18]  Qingsong Xu,et al.  Preparation of solid silver nanoparticles for inkjet printed flexible electronics with high conductivity. , 2014, Nanoscale.

[19]  Ying Wang,et al.  Nanostructures and nanomaterials , 2013 .

[20]  A. Manuilskiy,et al.  Evaluation of Coatings Applied to Flexible Substrates to Enhance Quality of Ink Jet Printed Silver Nano-Particle Structures , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[21]  K. Chou,et al.  Effect of polyvinyl pyrrolidone molecular weights on the formation of nanosized silver colloids , 2004 .

[22]  Jan G. Korvink,et al.  Inkjet printed, conductive, 25 μm wide silver tracks on unstructured polyimide , 2009 .

[23]  H Seppa,et al.  Contactless Electrical Sintering of Silver Nanoparticles on Flexible Substrates , 2011, IEEE Transactions on Microwave Theory and Techniques.

[24]  M. J. Rosen.  Surfactants and Interfacial Phenomena , 1978 .

[25]  Transient variation of a cross-sectional area of inkjet-printed silver nanoparticle ink during furnace sintering , 2014 .

[26]  Sunho Jeong,et al.  Direct writing of silver conductive patterns: Improvement of film morphology and conductance by controlling solvent compositions , 2006 .