Intelligent Network Communicator (INC) is proposed in this paper. The system has been defmed to show the validity of SOP concept to deal with the high performance, multiplefunctional system that will be needed for future electronic products. The function of INC testbed is to transmit and receive the mixed signal, that is the high speed digital and modulated RF signal, through the optical channel. INC system is composed of three blocks: Digital, Analog and Optical block to deal with the mixed signals effectively. To enable the single packaging solution, the various embedded components such as RF filters and power combiner have been developed based on the low cost material and package technologies. The INC system has been fabricated using the multi-layer organic process developed by NSF Packaging Research Center in Georgia Institute of Technology. The measured results of the crosstalk between the high-speed digital channels and the embedded RF components are presented. For the test of the system, 2.5Gbps digital signal and 7 GHz RF signal are combined together at the SOP board and transmitted through the multi-mode fiher after modulated by VCSEL.
[1]
Rao Tummala,et al.
Reliability assessment of microvias in HDI printed circuit boards
,
2002
.
[2]
Rao Tummala,et al.
Fundamentals of Microsystems Packaging
,
2001
.
[3]
Kyutae Lim,et al.
Novel combiner for hybrid digital/RF fiber-optic application
,
2002,
Proceedings RAWCON 2002. 2002 IEEE Radio and Wireless Conference (Cat. No.02EX573).
[4]
J. Laskar,et al.
RF-system-on-package (SOP) for wireless communications
,
2002,
IEEE Microwave Magazine.
[5]
G. G. Stokes.
"J."
,
1890,
The New Yale Book of Quotations.