论文信息 - Crossover photonic switching network with CMOS/SEED smart pixel device and 2D optical fiber bundle array

Crossover photonic switching network with CMOS/SEED smart pixel device and 2D optical fiber bundle array

A 16 X 16 Crossover photonic switching network with hybrid integrated CMOS/SEED smart pixel device and 2D optical fiber bundle array I/O access device is reported in this paper. SEEd array devices ar used as light receivers and transmitters, while CMOS devices make efficient logical processing. 4 X 40 2D multilayer optical fiber bundle arrays are fabricated and are used as I/O access devices in the crossover photonic switching network. The center to center spacing between adjacent optical fibers in the same layer of the fiber array is 125micrometers , and the spacing between adjacent layers is 250micrometers . Displacing tolerance of the fiber bundle arrays is less than 4 micrometers and the angular tilt error is less than 0.03 degree. It has the feature of high density, high precision, array permutation and easy to couple with 2D CMOS/SEED smart pixel device.

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