A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects
暂无分享,去创建一个
[1] A.T. Bryant,et al. Exploration of Power Device Reliability Using Compact Device Models and Fast Electrothermal Simulation , 2006, IEEE Transactions on Industry Applications.
[2] Gerhard Wachutka,et al. Reliability model for Al wire bonds subjected to heel crack failures , 2000 .
[3] Wolfgang Fichtner,et al. Lifetime prediction of IGBT modules for traction applications , 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).
[4] Li Yang,et al. Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling , 2011, Microelectron. Reliab..
[5] T. Matsunaga,et al. Thermal Fatigue Life Evaluation of Aluminum Wire Bonds , 2006, 2006 1st Electronic Systemintegration Technology Conference.
[6] Yasushi Yamada,et al. Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device , 2007, Microelectron. Reliab..
[7] Klaus-Dieter Lang,et al. Interface degradation of Al heavy wire bonds on power semiconductors during active power cycling measured by the shear test , 2010, 2010 6th International Conference on Integrated Power Electronics Systems.