A Fast Compact Thermal Model For Smart Phones

In this paper, we present a fast, compact thermal model for modeling the temperature of smartphones. Existing approaches use the finite element (FEM) or finite difference (FDM) based methods that are very slow. Even fast Green's function-based approaches always use such FEM/FDM based approaches to compute the Green's function (impulse response of a power source) in the first place. This significantly slows down the process of design space exploration. To ameliorate this, we propose an ultra-fast model that can be used to model the temperature of mobile phones: we use simple polynomial or exponential expressions to compute the Green's functions. These expressions can be evaluated very quickly and can be generalized for a wide variety of electronic components. In a smartphone, analysis of the temperature hotspots is very crucial in the design process. We can estimate the location of hotspots and the temperature rise at those hotspots with very high accuracy. Our error is limited to 2.56 % and our tool is 1300 times faster than the nearest competing, state-of-the-art tool.

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