Strain and Conduction-Band Offset in Narrow n-type FinFETs
暂无分享,去创建一个
D. Esseni | R. J. E. Hueting | J. Schmitz | D. Esseni | M. V. van Dal | T. van Hemert | B. Kaleli | R. Hueting | J. Schmitz | M. J. H. van Dal | B. Kaleli | T. van Hemert
[1] G. Iafrate,et al. Quantum correction to the equation of state of an electron gas in a semiconductor. , 1989, Physical review. B, Condensed matter.
[2] A. Perry. A contribution to the study of poisson's ratios and elasticconstants of TiN, ZrN and HfN , 1990 .
[3] D. Esseni,et al. Mobility Enhancement in Strained $n$ -FinFETs: Basic Insight and Stress Engineering , 2010, IEEE Transactions on Electron Devices.
[4] S. Laux,et al. Band structure, deformation potentials, and carrier mobility in strained Si, Ge, and SiGe alloys , 1996 .
[5] M. Ancona,et al. Macroscopic physics of the silicon inversion layer. , 1987, Physical review. B, Condensed matter.
[6] G. E. Pikus,et al. Symmetry and strain-induced effects in semiconductors , 1974 .
[7] Ben D. Fulcher,et al. Hardness analysis of cubic metal mononitrides from first principles , 2012 .
[8] Denis Flandre,et al. $g_{m}/I_{\rm d}$ Method for Threshold Voltage Extraction Applicable in Advanced MOSFETs With Nonlinear Behavior Above Threshold , 2010, IEEE Electron Device Letters.
[9] C.R. Cleavelin,et al. Body effect in tri- and pi-gate SOI MOSFETs , 2004, IEEE Electron Device Letters.
[10] Weileun Fang,et al. Determining the Poisson’s ratio of thin film materials using resonant method , 2003 .
[11] Moon J. Kim,et al. Effects of Film Stress Modulation Using TiN Metal Gate on Stress Engineering and Its Impact on Device Characteristics in Metal Gate/High- $k$ Dielectric SOI FinFETs , 2008, IEEE Electron Device Letters.
[12] J. Welser,et al. Strain dependence of the performance enhancement in strained-Si n-MOSFETs , 1994, Proceedings of 1994 IEEE International Electron Devices Meeting.
[13] L. Selmi,et al. Investigation of Strain Engineering in FinFETs Comprising Experimental Analysis and Numerical Simulations , 2011, IEEE Transactions on Electron Devices.
[14] S. Selberherr,et al. The Effect of General Strain on the Band Structure and Electron Mobility of Silicon , 2007, IEEE Transactions on Electron Devices.
[16] H. Nayfeh,et al. Strained silicon MOSFET technology , 2002, Digest. International Electron Devices Meeting,.
[17] R. Elliman,et al. Nanomechanical properties of sputter-deposited HfO2 and HfxSi1-xO2 thin films , 2011 .
[19] A. M. Howatson,et al. Engineering Tables and Data , 1972 .
[20] A. Hikavyy,et al. Highly manufacturable FinFETs with sub-10nm fin width and high aspect ratio fabricated with immersion lithography , 2007, 2007 IEEE Symposium on VLSI Technology.
[21] D. Esseni,et al. Extracting the conduction band offset in strained FinFETs from subthreshold-current measurements , 2011, 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC).
[22] Zheng-tang Liu,et al. First-Principles Investigations on Structural, Elastic, Electronic, and Optical Properties of Tetragonal HfSiO4 , 2012, Brazilian Journal of Physics.
[23] S. Thompson,et al. Uniaxial-process-induced strained-Si: extending the CMOS roadmap , 2006, IEEE Transactions on Electron Devices.
[24] Shihong Zhou,et al. The relationship between the thermal expansions and structures of ABO4 oxides , 2007 .
[25] L. A. Davis. Fracture toughnesses of metallic glasses , 1979 .
[26] T. Skotnicki,et al. Innovative Materials, Devices, and CMOS Technologies for Low-Power Mobile Multimedia , 2008, IEEE Transactions on Electron Devices.
[27] Hyman Joseph Levinstein,et al. Thermal stresses and cracking resistance of dielectric films (SiN, Si3N4, and SiO2) on Si substrates , 1978 .
[28] Y. Taur. An analytical solution to a double-gate MOSFET with undoped body , 2000 .
[29] K. F. Lee,et al. Scaling the Si MOSFET: from bulk to SOI to bulk , 1992 .
[30] W. Sharpe,et al. Techniques for measuring thermal expansion and creep of polysilicon , 2004 .
[31] S. Sugahara,et al. Carrier-Transport-Enhanced Channel CMOS for Improved Power Consumption and Performance , 2008, IEEE Transactions on Electron Devices.
[32] Extracting Energy Band Offsets on Long-Channel Thin Silicon-on-Insulator MOSFETs , 2009, IEEE Transactions on Electron Devices.
[33] R.M.D.A. Velghe,et al. Contribution to the characterization of the hump effect in MOSFET submicronic technologies , 1999, ICMTS 1999. Proceedings of 1999 International Conference on Microelectronic Test Structures (Cat. No.99CH36307).
[34] L. Selmi,et al. Nanoscale MOS Transistors , 2010 .
[35] R. L. Edwards,et al. Measurements of Young's modulus, Poisson's ratio, and tensile strength of polysilicon , 1997, Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots.