MOSFET gate leakage modeling and selection guide for alternative gate dielectrics based on leakage considerations
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Chenming Hu | Tsu-Jae King | Yee-Chia Yeo | Y. Yeo | C. Hu | T. King
[1] C. Hu,et al. Hole injection SiO/sub 2/ breakdown model for very low voltage lifetime extrapolation , 1994 .
[2] Walter A. Harrison,et al. Tunneling from an Independent-Particle Point of View , 1961 .
[3] T. P. Ma,et al. Making Silicon Nitride Film a Viable Gate Dielectric , 1998 .
[4] D. Schlom,et al. Thermodynamic stability of binary oxides in contact With silicon , 1996 .
[5] T. Ma,et al. Tunneling leakage current in oxynitride: dependence on oxygen/nitrogen content , 1998, IEEE Electron Device Letters.
[6] R. Wallace,et al. High-κ gate dielectrics: Current status and materials properties considerations , 2001 .
[7] Jack C. Lee,et al. MOSFET devices with polysilicon on single-layer HfO/sub 2/ high-K dielectrics , 2000, International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138).
[8] Chenming Hu,et al. Dual-metal gate CMOS technology with ultrathin silicon nitride gate dielectric , 2001, IEEE Electron Device Letters.
[9] T. Sugii,et al. Low standby power CMOS with HfO/sub 2/ gate oxide for 100-nm generation , 2002, 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303).
[10] J. Kim,et al. Current transport in metal/hafnium oxide/silicon structure , 2002, IEEE Electron Device Letters.
[11] Chenming Hu,et al. Two silicon nitride technologies for post-SiO2 MOSFET gate dielectric , 2001, IEEE Electron Device Letters.
[12] A. Stesmans,et al. Trap-assisted tunneling in high permittivity gate dielectric stacks , 2000 .
[13] C. Hu,et al. Hole injection oxide breakdown model for very low voltage lifetime extrapolation , 1993, 31st Annual Proceedings Reliability Physics 1993.
[14] E. Merzbacher. Quantum mechanics , 1961 .
[15] C. W. Chen,et al. Schottky barrier heights of tantalum oxide, barium strontium titanate, lead titanate, and strontium bismuth tantalate , 1999 .
[16] Chenming Hu,et al. Direct tunneling gate leakage current in transistors with ultrathin silicon nitride gate dielectric , 2000, IEEE Electron Device Letters.
[17] Chenming Hu,et al. Effects of high-/spl kappa/ gate dielectric materials on metal and silicon gate workfunctions , 2002, IEEE Electron Device Letters.
[18] Qi Xiang,et al. Scaling towards 35 nm gate length CMOS , 2001, 2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184).
[19] Chih-Wei Yang,et al. Downscaling limit of equivalent oxide thickness in formation of ultrathin gate dielectric by thermal-enhanced remote plasma nitridation , 2002 .
[20] N. G. Tarr,et al. An analytic model for the MIS tunnel junction , 1983, IEEE Transactions on Electron Devices.
[21] Stefan De Gendt,et al. Polarity effect on the temperature dependence of leakage current through HfO2/SiO2 gate dielectric stacks , 2002 .
[22] C. Hu,et al. Modeling CMOS tunneling currents through ultrathin gate oxide due to conduction- and valence-band electron and hole tunneling , 2001 .
[23] J.C. Lee,et al. MOSCAP and MOSFET characteristics using ZrO/sub 2/ gate dielectric deposited directly on Si , 1999, International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318).
[24] T. Nigam,et al. 50 nm vertical replacement-gate (VRG) nMOSFETs with ALD HfO/sub 2/ and Al/sub 2/O/sub 3/ gate dielectrics , 2001, International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).
[25] Chenming Hu. BSIM model for circuit design using advanced technologies , 2001, 2001 Symposium on VLSI Circuits. Digest of Technical Papers (IEEE Cat. No.01CH37185).
[26] Hongfa Luan,et al. Ultra Thin (<20@ CVD Si3N4 Gate Dielectric for Deep-Sub-Micron CMOS Devices , 1998 .
[27] M.F. Li,et al. Hole tunneling current through oxynitride/oxide stack and the stack optimization for p-MOSFETs , 2002, IEEE Electron Device Letters.
[28] D. Kwong,et al. High quality ultra thin CVD HfO/sub 2/ gate stack with poly-Si gate electrode , 2000, International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138).
[29] Hongfa Luan,et al. Two Silicon Nitride Technologies for Post , 2001 .
[30] H.-S. Philip Wong. Beyond the conventional transistor , 2002, IBM J. Res. Dev..
[31] J. Robertson. Band offsets of wide-band-gap oxides and implications for future electronic devices , 2000 .