Modeling and forecasting of manufacturing variations (embedded tutorial)

Process-induced variations are an important consideration in the design of integrated circuits. Until recently, it was sufficient to model die-to-die shifts in device performance, leading to the well known worst-case modeling and design methodology [1, 2]. However, current and near-future in-tegrated circuits are large enough that device and intercon-nect parameter variations within the chip are as important as those same variations from chip to chip. This presents a new set of challenges for process modeling and characterization and for the associated design tools and method-ologies. This paper examines the sources and trends of process variability, the new challenges associated with the increase in within-die variability analysis, and proposes a modeling and simulation methodology to deal with this variability.

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