Comparison of performance of high-power mid-IR QCL modules in actively and passively cooled mode

We report on the effects of active and passive cooling on the performance of high power mid-IR QCL modules (λ ≈ 3.9 μm) in quasi-cw mode. In active cooling mode, a thermo-electrical cooler attached with its hot side to a heat sink of constant temperature, a local thermometer in close proximity to the QCL chip (epi-down mounted) as well as a control unit has been used for temperature control of the QCL submount. In contrast, the passive cooling was performed by attaching the QCL module solely to the heat sink. Electro-optical light-current- (L-I-) curves are measured in a quasi-cw mode, from which efficiencies can be deduced. Waiving of the active cooling elements results in a drop of the maximum intensity of less than 5 %, compared to the case wherein the temperature of the submount is stabilized to the temperature of the heat sink. The application of a model of electro-optical performance to the data shows good agreement and captures the relevant observations. We further determine the heat resistance of the module and demonstrate that the system performance is not limited by the packaging of the module, but rather by the heat dissipation on the QCL chip itself.