Minimizing Critical Access Time for 3D Data Bus Based on Inserted Bus Switches and Repeaters
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[1] Yehea Ismail,et al. Optimum positioning of interleaved repeaters in bidirectional buses , 2005, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[2] Sudeep Pasricha,et al. 3D-Wiz: A novel high bandwidth, optically interfaced 3D DRAM architecture with reduced random access time , 2014, 2014 IEEE 32nd International Conference on Computer Design (ICCD).
[3] Jan-Ou Wu,et al. Maximal Delay Reduction for RLC-Based Multi-Source Multi-Sink Bus with Repeater Insertion , 2009, Circuits Syst. Signal Process..
[4] W. C. Elmore. The Transient Response of Damped Linear Networks with Particular Regard to Wideband Amplifiers , 1948 .
[5] Taewhan Kim,et al. Clock tree synthesis with pre-bond testability for 3D stacked IC Designs , 2010, Design Automation Conference.
[6] Shyue-Kung Lu,et al. Electrical test method of open defects at data buses in 3D SRAM IC , 2014, 2014 International Conference on Electronics Packaging (ICEP).
[7] Masoud Daneshtalab,et al. HIBS — Novel inter-layer bus structure for stacked architectures , 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.
[8] Chia-Chun Tsai,et al. Performance driven bus buffer insertion , 1996, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[9] Tae Won Cho,et al. Analysis of system bus on SoC platform using TSV interconnection , 2012, 2012 4th Asia Symposium on Quality Electronic Design (ASQED).