A semiconductor package

The present invention relates to a semiconductor package, the technical problem to be solved lies in that an adhesive is coated on the outer periphery of the bump in the lower face of the wafer, and improving the defect that occurs when picking up a semiconductor die mounted on the tape after sawing. And a wafer preparation step of this invention for preparing a wafer by coating a first adhesive on the bottom is To this end, a wafer-attach step to attach control of the wafer on the mount tape to attach the lower surface of the wafer a first adhesive coated on the mounting band by sawing the wafer discloses a semiconductor package and a method of manufacturing comprising the steps of: die-attach attach the sawing step, and a semiconductor die to the semiconductor die to separate the individually formed on the circuit board wiring patterns.