Machine Learning Based Energy-Efficient Design Approach for Interconnects in Circuits and Systems

In this paper, we propose an efficient design methodology for energy-efficient off-chip interconnect. This approach leverages an artificial neural network (ANN) as a surrogate model that significantly improves design efficiency in the frequency-domain. This model utilizes design specifications as the constraint functions to guarantee the satisfaction of design requirements. Additionally, a specified objective function to select low-loss and low-noise structure is employed to determine the optimal case from a large design space. The proposed design flow can find the optimum design that gives maximum eye height (EH) with the largest allowable transmitter supply voltage (VTX) reduction for minimum power consumption. The proposed approach is applied to the microstrip line and stripline structures with single-ended and differential signals for general applicability. For the microstrip line, the proposed methodology performs at a performance speed with 42.7 and 0.5 s per structure for the data generation and optimization process, respectively. In addition, the optimal microstrip line design achieves a 25%VTX reduction. In stripline structures, it takes 31.9 s for the data generation and 0.6 s for the optimization process per structure when the power efficiency reaches a maximum 30.7% peak to peak VTX decrease.

[1]  Naresh R. Shanbhag,et al.  Design of Energy-Efficient High-Speed Links via Forward Error Correction , 2010, IEEE Transactions on Circuits and Systems II: Express Briefs.

[2]  W. John,et al.  Modeling of striplines between a power and a ground plane , 2006, IEEE Transactions on Advanced Packaging.

[3]  Jun Fan,et al.  Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz , 2009, IEEE Transactions on Microwave Theory and Techniques.

[4]  Dipanjan Gope,et al.  Eye Height/Width Prediction From $S$ -Parameters Using Learning-Based Models , 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[5]  Dipanjan Gope,et al.  S-Parameter and Frequency Identification Method for ANN-Based Eye-Height/Width Prediction , 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[6]  Sebastian Müller,et al.  Energy-aware analysis of electrically long high speed I/O links , 2012, Computer Science - Research and Development.

[7]  Chan Hong Goay,et al.  Crosstalk modeling in high-speed transmission lines by multilayer perceptron neural networks , 2019, Neural Computing and Applications.

[8]  Young H. Kwark,et al.  Energy-Aware Signal Integrity Analysis for High-Speed PCB Links , 2015, IEEE Transactions on Electromagnetic Compatibility.

[9]  J. H. Constable,et al.  Interconnection channel capacity under crosstalk noise , 1999 .

[10]  David Blaauw,et al.  Hardware Designs for Security in Ultra-Low-Power IoT Systems: An Overview and Survey , 2017, IEEE Micro.

[11]  Jun Fan,et al.  Fast and Precise High-Speed Channel Modeling and Optimization Technique Based on Machine Learning , 2018, IEEE Transactions on Electromagnetic Compatibility.

[12]  Vir V. Phoha,et al.  On the Feature Selection Criterion Based on an Approximation of Multidimensional Mutual Information , 2010, IEEE Transactions on Pattern Analysis and Machine Intelligence.

[13]  Yue Lu,et al.  Design and Analysis of Energy-Efficient Reconfigurable Pre-Emphasis Voltage-Mode Transmitters , 2013, IEEE Journal of Solid-State Circuits.

[14]  Vladimir Stojanovic,et al.  An Energy-Efficient Equalized Transceiver for RC-Dominant Channels , 2010, IEEE Journal of Solid-State Circuits.