$48\times10$ -Gb/s Cost-Effective FPC-Based On-Board Optical Transmitter and Receiver

In this paper, we demonstrate a low-cost, 48-channel, high-speed, flexible printed circuit (FPC)-based interconnect packaging concept for on-board optical modules. Due to the good high-speed performance and low cost, the FPC board is used as the base carrier for both transmitter and receiver modules. The on-board transmitter and receiver are based on a commercial 1-mm-pitch ISI HoLi pin grid array connector. The size of each module is only 31.5 <inline-formula> <tex-math notation="LaTeX">$\text {mm} \times 31.5$ </tex-math></inline-formula> mm and offers a state-of-art bandwidth density of 0.483 Gb/s/mm<sup>2</sup> by using a compact design. Investigation of RF signal propagation on the FPC is carried out for design validation at 10 Gb/s and, in order to further explore the potential of the suggested platform, differential pairs are simulated up to 30 GHz. The low-cost packaging approach requires only several flip-chip bonding steps using industry-standard solder reflow and ultrasonic bonding processes. An <inline-formula> <tex-math notation="LaTeX">$8 \times 12$ </tex-math></inline-formula>-channel optical straight lens connector is used to couple the light from the optics into two 48-fiber multi-fiber push on connectors with <inline-formula> <tex-math notation="LaTeX">$8 \times 12$ </tex-math></inline-formula>-channel MT ferrules. The fully assembled transmitter and receiver are tested at 10 Gb/s demonstrating error-free operation with sensitivities comparable with those of commercial devices. Bit error rates for all 96 channels as well as representative eye diagrams at 10 Gb/s are reported.

[1]  Takashi Shiraishi,et al.  Novel trace design for high data-rate multi-channel optical transceiver assembled using flip-chip bonding , 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

[2]  C. Schow,et al.  Terabit/Sec VCSEL-Based 48-Channel Optical Module Based on Holey CMOS Transceiver IC , 2013, Journal of Lightwave Technology.

[3]  H. J. S. Dorren,et al.  Challenges for Optically Enabled High-Radix Switches for Data Center Networks , 2015, Journal of Lightwave Technology.

[4]  Nicola Calabretta,et al.  Optical solutions for the challenges of mega-size data center networks , 2016, 2016 Optical Fiber Communications Conference and Exhibition (OFC).

[5]  Anthony Chan Carusone,et al.  Capacitively-Coupled CMOS VCSEL Driver Circuits , 2016, IEEE Journal of Solid-State Circuits.

[6]  Hong Liu,et al.  Scaling Optical Interconnects in Datacenter Networks Opportunities and Challenges for WDM , 2010, 2010 18th IEEE Symposium on High Performance Interconnects.

[7]  Chris Cole Future datacenter interfaces based on existing and emerging optics technologies , 2013, 2013 IEEE Photonics Society Summer Topical Meeting Series.

[8]  Nicola Calabretta,et al.  Towards standardization of compact data center switches , 2017, ICT Express.

[9]  Kazuya Nagashima,et al.  A Very High-Dense on-Board Optical Module Realizing >1.3 Tb/s/Inch ^2 , 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

[10]  Ali Ghiasi,et al.  Large data centers interconnect bottlenecks. , 2015, Optics express.

[11]  Mariko Sugawara,et al.  40-Gb/s Cost-Effective FPC-Based Optical Engine for Optical Interconnect Using Novel High-Speed FPC Connector , 2013 .

[12]  Oded Raz,et al.  Chip Scale 12-Channel 10 Gb/s Optical Transmitter and Receiver Subassemblies Based on Wet Etched Silicon Interposer , 2017, Journal of Lightwave Technology.