Cost-performance wafer thinning technology

Considering their ease of carrying, consumers love to purchase the portable consumer product, like a Cell phone, DSC, Camcorder etc, with the features of light weight, small size and multi-function. In order to satisfy this need from consumers, two cost-effective solutions for the consumer product designers are: (1) Adopt the thm package to ”iize the end product size and weight; (2) Adopt the stacked-die package integrating several functions in one package as SIP (system in package) to make the end product multi-functional. No doubt the volume of these kinds of packages will be ramping up dramatically from now on. A reliable, cost-effective wafer thinning technology is the crucial factor to make the thin and stacked-die package commercialized. So far, there are three types of wafer thinning technologies available - Mechanical Grinding + Wet Polishing, Mechanical Grinding + Chemical Etching and Mechanical Grinding + Plasma Etching. After evaluation, Mechanical Grinding + Wet Polishing is selected due to its superior performance in cost and quality. The 4 mil thickness for 8 wafer and 6 mil thickness for 12” wafer are available by using Mechanical Grinding + Wet Polishing wafer thinning technology after process optimization.