SuperSPARC multichip module
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S. Rusu | T. Gannon | F. Cano | G. Hamilton | M. Murtuza | A. Mehta | J. Kennedy | K. Johnson | D. Anderson | D. Chong | D. Brady | P. Hundt | N. H. Hong | F. Valente | S. Kaul
[1] W. Bertram,et al. Multi-chip packaging technology for VLSI-based systems , 1987, 1987 IEEE International Solid-State Circuits Conference. Digest of Technical Papers.
[2] Christopher Henry Bajorek,et al. The thin-film module as a high-performance semiconductor package , 1982 .
[3] E. E. Davidson,et al. Electrical design of a high speed computer package , 1982 .
[4] Lih-Tyng Hwang,et al. Calculation of electrical parameters of a thin-film multichip package , 1989 .
[5] T. Sarkar,et al. Multiconductor Transmission Lines In Multilayered Dielectric Media , 1984 .
[6] H. You,et al. Analysis and simulation of multiconductor transmission lines for high-speed interconnect and package design , 1990 .
[7] E. Bogatin,et al. Design rules for microstrip capacitance , 1988 .
[8] R. Fabian Pease,et al. Physical limits to the useful packaging density of electronic systems , 1988 .