Moiré Methods for Engineering and Science — Moiré Interferometry and Shadow Moiré

Moire interferometry and shadow moire are extraordinarily versatile and effective methods for determining in-plane and out-of-plane displacement fields, respectively. The basic concepts are reviewed for both methods, topics on practice and analysis are addressed, and numerous examples of important applications are presented.

[1]  J. McKelvie,et al.  A practical multiplied-moiré system , 1978 .

[2]  Bongtae Han,et al.  Micromechanical deformation analysis of beta alloy titanium in elastic and elastic/plastic tension , 1996 .

[3]  D. Post,et al.  Determination of thermal strains by moiré interferometry , 1989 .

[4]  P. Ifju,et al.  High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials , 1995 .

[5]  Bongtae Han,et al.  Deformation Mechanism of Two-Phase Solder Column Interconnections Under Highly Accelerated Thermal Cycling Condition: An Experimental Study , 1997 .

[6]  Yinyan Wang,et al.  On-Line Measurement of Thermally Induced Warpage of BGAs with High Sensitivity Shadow Moiré , 1998 .

[7]  D. Mollenhauer,et al.  Interlaminar Deformation at a Hole in Laminated Composites: A Detailed Experimental Investigation Using Moire Interferometry , 1997 .

[8]  B. Han,et al.  Interferometric methods with enhanced sensitivity by optical/digital fringe multiplication. , 1993, Applied optics.

[9]  Albert S. Kobayadhi Experimental Techniques in Fracture Mechanics , 1975 .

[10]  Bongtae Han,et al.  Determination of an effective coefficient of thermal expansion of electronic packaging components: a whole-field approach , 1996 .

[11]  Bongtae Han,et al.  Immersion interferometer for microscopic moiré interferometry , 1992 .

[12]  P. Hariharan,et al.  Quasi- heterodyne hologram interferometry , 1985 .

[13]  Yifan Guo,et al.  Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation , 1993, IBM J. Res. Dev..

[14]  Krzysztof Patorski,et al.  Handbook of the moiré fringe technique , 1993 .

[15]  Peter Ifju,et al.  The use of moiré interferometry as an aid to standard test-method development for textile composite materials , 1995 .

[16]  Gary Cloud,et al.  Optical Methods of Engineering Analysis , 1996 .

[17]  D. Post,et al.  Thick Composites in Compression: An Experimental Study of Micromechanical Behavior and Smeared Engineering Properties , 1992 .

[18]  Bongtae Han,et al.  High sensitivity moiré , 1994 .

[19]  D. Post,et al.  The governing equations for moiré interferometry and their identity to equations of geometrical moiré , 1985 .

[20]  Oded Kafri,et al.  The physics of moire metrology , 1990 .

[21]  D. Post Moiré fringe multiplication with a nonsymmetrical doubly blazed reference grating. , 1971, Applied optics.

[22]  P. Ifju,et al.  Shear testing of textile composite materials , 1995 .

[23]  Bongtae Han,et al.  Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods , 1996 .

[24]  Raymond G. Boeman,et al.  Interlaminar deformations on the cylindrical surface of a hole in laminated composites : an experimental study , 1990 .

[25]  Bongtae Han,et al.  Higher sensitivity moire interferometry for micromechanics studies , 1992 .

[26]  Bongtae Han,et al.  Real-time warpage measurement of electronic components with variable sensitivity , 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

[27]  Bongtae Han,et al.  Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry , 1995 .