论文信息 - TSV-Last Integration to Replace ASIC Wire Bonds in the Assembly of X-Ray Detector Arrays - 字舞流文

TSV-Last Integration to Replace ASIC Wire Bonds in the Assembly of X-Ray Detector Arrays

D. Bordelon | D. Malta | J. Grindlay | Jaesub Hong | H. Miyasaka | D. Violette | B. Allen | Jennifer Ovental Hicks | Daniel Richter