A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds
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Yen-Fu Liu | Hung-Chieh Cheng | Chien-Pan Liu | Chang-Hung Li | Yi-Chun Kung | Jeng-Yu Lin | Hung-Chieh Cheng | Jeng-Yu Lin | Chien-Pan Liu | Yi-Chun Kung | Yen-Fu Liu | C. Li
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