Camera module and methods for preparing

The invention relates to a camera module (1) including a lens housing (2) with an optical system (3), an image sensor chip (5) wire bonding connections (6), and a circuit board (8) for contacting the image sensor chip (5) includes. According to the invention it is provided that the circuit board (8) is formed with wire bonding faces (8a) are connected to which the wire bonds (6) of the image sensor chip (5), and the arrangement of image sensor chip (5) and circuit board (8) is configured such that focus adjusted taking advantage of the flexibility of the wire bond connections (6) of the image sensor chip (5) by a relative change in position with respect to the printed circuit board (8) of the image sensor chip (5) on the optical system (3). Further, the invention relates to a method of manufacturing the camera module of the invention.