Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy
暂无分享,去创建一个
[1] Sung K. Kang,et al. The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue , 2004 .
[2] Sung K. Kang,et al. Ag_3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys , 2002 .
[3] S. Choi,et al. Orientation imaging studies of Sn-based electronic solder joints , 2002 .
[4] K. S. Kim,et al. Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys , 2002 .
[5] A. Scotch,et al. Determination of the eutectic structure in the Ag-Cu-Sn system , 2002 .
[6] C. Handwerker,et al. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys , 2000 .
[7] Morris E. Fine,et al. Tin-silver-copper eutectic temperature and composition , 2000 .
[8] I. Anderson,et al. A viable tin-lead solder substitute: Sn-Ag-Cu , 1994 .