Package Characterization: Simulations or Measurements?

As the functionality of thermal simulators gets more and more complex, measurement techniques also improve. Thermal engineers face and increasingly difficult task to make the right selection from the existing tools. In this paper the applicability of the JEDEC JESD 51-1 static measurement method is compared to mainstream simulation tools especially MCAD or EDA embedded CFD solutions. Both techniques are opposed to each other in terms of required time and other expense factors. In this paper we discuss when different aspects of trade-offs to be made between thermal simulation and physical testing.

[1]  A. Poppe,et al.  Electric and thermal transient effects in high power optical devices , 2004, Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545).

[2]  M. Lenz,et al.  Thermal transient characterization methodology for single-chip and stacked structures , 2005, Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..

[3]  E.A. Garcia,et al.  Two-resistor compact modeling for multiple die and multi-chip packages , 2005, Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..

[4]  B. Joiner,et al.  Measurement and Simulation of Stacked Die Thermal Resistances , 2006, IEEE Transactions on Components and Packaging Technologies.

[5]  Andras Poppe,et al.  Thermal Characterization and Modeling of Stacked Die Packages , 2005 .

[7]  M. Rencz,et al.  Structure function evaluation of stacked dies , 2004, Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545).

[8]  Xuejun Fan Development, validation, and application of thermal modeling for a MCM power package , 2003, Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003..

[9]  M. Rencz,et al.  Testing Interface Thermal Resistance , 2007, 2007 9th Electronics Packaging Technology Conference.

[10]  M. Rencz,et al.  DELPHI Style Compact Modeling of Stacked Die Packages , 2007, Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

[11]  T. Treurniet,et al.  Thermal management in color variable multi-chip led modules , 2006, Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium.