LES of heat transfer in electronics

Abstract Numerical methods based on the Reynolds Averaged Navier–Stokes (RANS) and Large Eddy Simulation (LES) equations are applied to the thermal prediction of flows representative of those found in and around electronics systems and components. Low Reynolds number flows through a heated ribbed channel, around a heated cube and within a complex electronics system case are investigated using linear and nonlinear LES models, hybrid RANS–LES and RANS–Numerical-LES (RANS–NLES) methods. Flow and heat transfer predictions using these techniques are in good agreement with each other and experimental data for a range of grid resolutions. Using second order central differences, the RANS–NLES method performs well for all simulations.

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