Prediction of Delamination Related IC & Packaging Reliability Problems

Abstract This paper presents our effort to predict delamination related IC & packaging reliability problems. These reliability problems are driven by the mismatch between the different material properties, such as thermal expansion, hygro-swelling, and/or the degradation of interfacial strength. First of all, a test technique is presented to measure the interfacial strength between packaging materials. Secondly, several reliable non-linear Finite Element models are developed, able to predict the reliability impact of delamination on wire failures, different package structures, and passivation cracks in IC-packages.

[1]  W. D. van Driel,et al.  Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound , 2003 .

[2]  Theodore J. Reinhart,et al.  Engineered materials handbook , 1987 .

[3]  Willem D. van Driel,et al.  Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods , 2004, Microelectron. Reliab..

[4]  Thiam Beng Lim,et al.  Moisture diffusion and vapour pressure modeling of IC packaging , 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

[5]  G. Q. Zhang,et al.  The challenges of virtual prototyping and qualification for future microelectronics , 2003, Microelectron. Reliab..

[6]  W. V. van Driel,et al.  On wire failures in micro-electronic packages , 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

[7]  Michael V. Swain,et al.  Modified four-point bending specimen for determining the interface fracture energy for thin, brittle layers , 1998 .

[8]  R. Pearson,et al.  Processing-adhesion relations for die attach adhesives and underfill resins , 1998, Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180).

[9]  Paul S. Ho,et al.  Adhesion measurement for electronic packaging applications using double cantilever beam method , 2000 .

[10]  Paul S. Ho,et al.  Packaging effects on reliability of Cu/low-k interconnects , 2003 .

[11]  Willem D. van Driel,et al.  Characterization and Modelling of Moisture Driven Interface Failures , 2004, Microelectron. Reliab..

[12]  Yong Liu,et al.  Thermosonic wire bonding process simulation and bond pad over active stress analysis , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[13]  H. Saunders,et al.  Advanced Fracture Mechanics , 1985 .

[14]  Guoqi Zhang,et al.  Response surface modeling for nonlinear packaging stresses , 2003 .

[15]  Willem D. van Driel,et al.  Virtual qualification of moisture induced failures of advanced packages [IC packages] , 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.