Prediction of Delamination Related IC & Packaging Reliability Problems
暂无分享,去创建一个
Willem D. van Driel | G. Q. Zhang | Richard B. R. van Silfhout | M. A. J. van Gils | W. Driel | G. Zhang | R. V. Silfhout | M. V. Gils
[1] W. D. van Driel,et al. Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound , 2003 .
[2] Theodore J. Reinhart,et al. Engineered materials handbook , 1987 .
[3] Willem D. van Driel,et al. Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods , 2004, Microelectron. Reliab..
[4] Thiam Beng Lim,et al. Moisture diffusion and vapour pressure modeling of IC packaging , 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
[5] G. Q. Zhang,et al. The challenges of virtual prototyping and qualification for future microelectronics , 2003, Microelectron. Reliab..
[6] W. V. van Driel,et al. On wire failures in micro-electronic packages , 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
[7] Michael V. Swain,et al. Modified four-point bending specimen for determining the interface fracture energy for thin, brittle layers , 1998 .
[8] R. Pearson,et al. Processing-adhesion relations for die attach adhesives and underfill resins , 1998, Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180).
[9] Paul S. Ho,et al. Adhesion measurement for electronic packaging applications using double cantilever beam method , 2000 .
[10] Paul S. Ho,et al. Packaging effects on reliability of Cu/low-k interconnects , 2003 .
[11] Willem D. van Driel,et al. Characterization and Modelling of Moisture Driven Interface Failures , 2004, Microelectron. Reliab..
[12] Yong Liu,et al. Thermosonic wire bonding process simulation and bond pad over active stress analysis , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[13] H. Saunders,et al. Advanced Fracture Mechanics , 1985 .
[14] Guoqi Zhang,et al. Response surface modeling for nonlinear packaging stresses , 2003 .
[15] Willem D. van Driel,et al. Virtual qualification of moisture induced failures of advanced packages [IC packages] , 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.