论文信息 - On the spectrum of effective obstacles to thermally activated glide in solid solutions

On the spectrum of effective obstacles to thermally activated glide in solid solutions

The strength of effective obstacles to thermally activated dislocation movement in copper-based solid solutions at 4-700K has been evaluated by comparing the experimental temperature dependence of the critical resolved shear stress with that formulated by Kratochvil et al. (1973). Fairly large values of the intrinsic height of the thermally activable barrier at 'plateau' temperatures seemingly suggest that dislocation intersection rather than breakaway from solute atoms could determine the rate in this temperature range.

M. Nasir | M. Z. Butt | R. Qamar

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