论文信息 - The effect of antimony, chloride ion, and glue on copper electrorefining - 字舞流文

The effect of antimony, chloride ion, and glue on copper electrorefining

T. O’keefe | L. R. Hurst

[1] V. I. Lakshmanan,et al. The effect of chloride ion in the electrowinning of copper , 1977 .

[2] A. Brenner,et al. Electrodeposition of Alloys , 1964 .

[3] D. R. Turner,et al. The Effect of Some Addition Agents on the Kinetics of Copper Electrodeposition from a Sulfate Solution I . Cathode Potential‐Current Density Relation , 1962 .

[4] W. Gauvin,et al. The Effect of Chloride Ions on Copper Deposition , 1952 .

[5] W. Gauvin,et al. The Effects of Halides on Copper Deposition in the Presence of Gelatin , 1952 .

[6] Yu‐lin Yao. Functions of Chloride in Copper‐Refining Electrolyte , 1944 .

[7] J. Newton,et al. Metallurgy of copper , 1942 .

[8] R. Taft,et al. The Electrodeposition of Copper in Presence of Gelatin , 1930 .