3GHz through-hole signal via model considering power/ground plane resonance coupling and via neck effect

[1]  R. Ito,et al.  RF modeling of vertical interconnection between power-ground plane combined with 2D TLM , 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).

[2]  Y. E. Yang,et al.  Modeling and analysis of vias in multilayered integrated circuits , 1993 .

[3]  Jin-Ho Kim,et al.  Analysis of via in multilayer printed circuit boards for high-speed digital systems , 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).