A New TDDB Degradation Model Based on Cu Ion Drift in Cu Interconnect Dielectrics
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K. Makabe | E. Murakami | N. Suzumura | S. Yamamoto | D. Kodama | J. Komori | S. Maegawa | K. Kubota | S. Maegawa | J. Komori | D. Kodama | E. Murakami | K. Kubota | S. Yamamoto | N. Suzumura | K. Makabe
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