Dynamic electro-thermal modeling in Power Electronics Building Block (PEBB) applications

This paper proposes a dynamic electro-thermal methodology via a reasonable iterative algorithm for Power Electronics Building Block (PEBB) application. The modeling includes an improved power loss distribution model which has temperature dependent self-improvement ability and an effective thermal model providing a fast temperature calculation, which can be integrated with electrical model directly. Simulation results are eventually presented to verify the effectiveness of the proposed modeling method in an PEBB application. The proposed dynamic electro-thermal model is proved that it can provide fast and accurate information for shifting PEBBs in their parallel operation and thus improve the PEBB's efficiency and semiconductor's life time.

[1]  Jerry L. Hudgins,et al.  Circuit simulator models for the diode and IGBT with full temperature dependent features , 2001, 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230).

[2]  J. Kolar,et al.  A Thermal Model of a Forced-Cooled Heat Sink for Transient Temperature Calculations Employing a Circuit Simulator , 2006 .

[3]  Sibylle Dieckerhoff,et al.  Comparison of state-of-the-art voltage source converter topologies for medium voltage applications , 2003, 38th IAS Annual Meeting on Conference Record of the Industry Applications Conference, 2003..

[4]  Jia Tzer Hsu,et al.  A rational formulation of thermal circuit models for electrothermal simulation. I. Finite element method [power electronic systems] , 1996 .

[5]  F. Casanellas,et al.  Losses in PWM inverters using IGBTs , 1994 .

[6]  Jia Tzer Hsu,et al.  A rational formulation of thermal circuit models for electrothermal simulation-Part I: Finite element method , 1996 .

[7]  Ashwin M. Khambadkone,et al.  Analytical power loss evaluation of 5 level H-Bridge with coupled inductor and series connected H-Bridge for PEBB applications , 2009, 2009 International Conference on Power Electronics and Drive Systems (PEDS).

[8]  Lixiang Wei,et al.  Evaluation of Power Semiconductors Power Cycling Capabilities for Adjustable Speed Drive , 2008, 2008 IEEE Industry Applications Society Annual Meeting.

[9]  D. Boroyevich,et al.  Design and Evaluation of a 33-kW PEBB Module for Distributed Power Electronics Conversion Systems , 2005, 2005 IEEE 36th Power Electronics Specialists Conference.

[10]  Y. Ito,et al.  Parallel redundant operation of UPS with robust current minor loop , 1997, Proceedings of Power Conversion Conference - PCC '97.

[11]  Thomas A. Lipo,et al.  Analysis of Power Cycling Capability of IGBT Modules in a Conventional Matrix Converter , 2008, 2008 IEEE Industry Applications Society Annual Meeting.

[12]  R. W. De Doncker,et al.  Reliability Prediction for Inverters in Hybrid Electrical Vehicles , 2007 .

[13]  Ching-Lung Chu,et al.  Combination voltage-controlled and current-controlled PWM inverters for UPS parallel operation , 1995 .

[14]  U. Drofenik,et al.  A General Scheme for Calculating Switching- and Conduction-Losses of Power Semiconductors in Numerical Circuit Simulations of Power Electronic Systems; International Power Electronics Conference; ; IPEC-Niigata 2005 , 2005 .

[15]  Qi Zhi-ping.  Cryogenic Study and Modeling of IGBTs , 2006 .

[16]  ChangHwan Kim,et al.  Parallel UPS with a instantaneous current sharing control , 1998, IECON '98. Proceedings of the 24th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.98CH36200).

[17]  Wolfgang Fichtner,et al.  Lifetime prediction and design of reliability tests for high-power devices in automotive applications , 2003 .

[18]  Mariusz Malinowski,et al.  Comparison of 2.3-kV Medium-Voltage Multilevel Converters for Industrial Medium-Voltage Drives , 2007, IEEE Transactions on Industrial Electronics.

[19]  Ahmed Lakhsasi,et al.  Transient thermal analysis of fast switching devices by partially coupled FEM method , 2006, 2006 Canadian Conference on Electrical and Computer Engineering.

[20]  Lixiang Wei,et al.  Junction Temperature Prediction of a Multiple-chip IGBT Module under DC Condition , 2006, Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting.

[21]  S. Bernet,et al.  Estimation and measurement of junction temperatures in a three-level voltage source converter , 2005, Fourtieth IAS Annual Meeting. Conference Record of the 2005 Industry Applications Conference, 2005..

[22]  Ashwin M. Khambadkone,et al.  Control of paralleled PEBBs to facilitate the efficient operation of microgrid , 2010, 2010 IEEE International Symposium on Industrial Electronics.

[23]  Tsai-Fu Wu,et al.  3C strategy for inverters in parallel operation achieving an equal current distribution , 2000, IEEE Trans. Ind. Electron..

[24]  Ashwin M. Khambadkone,et al.  Combined active and reactive power control of power converter building block to facilitate the connection of micro-grid to Electric Power system , 2009, 2009 IEEE Energy Conversion Congress and Exposition.

[25]  Bin Du,et al.  Transient Electrothermal Simulation of Power Semiconductor Devices , 2010, IEEE Transactions on Power Electronics.

[26]  S. S. Fazel,et al.  Comparison of power semiconductor utilization, losses and harmonic spectra of state-of-the-art 4.16 kV multi-level voltage source converters , 2005, 2005 European Conference on Power Electronics and Applications.

[27]  G. Nicoletti,et al.  Fast power cycling test of IGBT modules in traction application , 1997, Proceedings of Second International Conference on Power Electronics and Drive Systems.

[28]  U. Drofenik,et al.  Thermal analysis of a multi-chip Si/SiC-power module for realization of a bridge leg of a 10 kW Vienna rectifier , 2003, The 25th International Telecommunications Energy Conference, 2003. INTELEC '03..

[29]  Lipei Huang,et al.  Novel control for redundant parallel UPSs with instantaneous current sharing , 2002, Proceedings of the Power Conversion Conference-Osaka 2002 (Cat. No.02TH8579).