Modelling of double air-bridged structured inductor implemented by a GaAs integrated passive device manufacturing process

In order to provide excellent performance and show the development of a complicated structure in a module and system, this paper presents a double air-bridge-structured symmetrical differential inductor based on integrated passive device technology. Corresponding to the proposed complicated structure, a new manufacturing process fabricated on a high-resistivity GaAs substrate is described in detail. Frequency-independent physical models are presented with lump elements and the results of skin effect-based measurements. Finally, some key features of the inductor are compared; good agreement between the measurements and modeled circuit fully verifies the validity of the proposed modeling approach. Meanwhile, we also present a comparison of different coil turns for inductor performance. The proposed work can provide a good solution for the design, fabrication, modeling, and practical application of radio-frequency modules and systems.

[1]  Le Luo,et al.  Suspended high Q integrated inductor by wafer level packaging technology , 2015 .

[2]  Nam-Young Kim,et al.  A high performance compact Wilkinson power divider using GaAs-based optimized integrated passive device fabrication process for LTE application , 2015 .

[3]  Peter Ashburn,et al.  Analytical and numerical model of spiral inductors on high resistivity silicon substrates , 2014 .

[4]  J. Yook,et al.  Equivalent model of circular‐type spiral inductor in printed circuit board , 2013 .

[5]  Chun-Lin Ko,et al.  2.4-GHz Complementary Metal Oxide Semiconductor Power Amplifier Using High-Quality Factor Wafer-Level Bondwire Spiral Inductor , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[6]  Nam-Young Kim,et al.  Design of Very Compact Bandpass Filters Based on Differential Transformers , 2015, IEEE Microwave and Wireless Components Letters.

[7]  Nadir Idir,et al.  High-Frequency Behavioral Ring Core Inductor Model , 2016, IEEE Transactions on Power Electronics.

[8]  S. Koul,et al.  Model extraction of micromachined planar inductors implemented on alumina substrate , 2015 .

[9]  Y. C. Shih,et al.  A broadband parameter extraction technique for the equivalent circuit of planar inductors , 1992, 1992 IEEE Microwave Symposium Digest MTT-S.

[10]  Xi Yang,et al.  Significantly Enhanced Inductance and Quality Factor of GHz Integrated Magnetic Solenoid Inductors With FeGaB/ ${\rm Al}_{2}{\rm O}_{3}$ Multilayer Films , 2014, IEEE Transactions on Electron Devices.

[11]  John G. Jones,et al.  Voltage Tunable Magnetoelectric Inductors With Improved Operational Frequency and Quality Factor for Power Electronics , 2015, IEEE Transactions on Magnetics.

[12]  Jun Li,et al.  Verification of transmission line de-embedding method for on-chip spiral inductor based on electromagnetic simulation , 2016 .

[13]  Zhigong Wang,et al.  Modified T-Model With an Improved Parameter Extraction Method for Silicon-Based Spiral Inductors , 2014, IEEE Microwave and Wireless Components Letters.

[14]  Joachim Oberhammer,et al.  Through-Silicon Vias and 3D Inductors for RF Applications , 2014 .

[15]  Chih-Ming Tai,et al.  Multilevel Suspended Thin-Film Inductors on Silicon Wafers , 2007, IEEE Transactions on Electron Devices.

[16]  Fang Zhang,et al.  A novel method for the fabrication of integrated passive devices on SI-GaAs substrate , 2011 .

[17]  S. Wong,et al.  Physical modeling of spiral inductors on silicon , 2000 .

[18]  Quan Xue,et al.  Analysis and Equivalent-Circuit Model for CMOS On-Chip Multiple Coupled Inductors in the Millimeter-Wave Region , 2015, IEEE Transactions on Electron Devices.

[19]  Alireza Saberkari,et al.  Design and comparison of flipped active inductors with high quality factors , 2014 .

[20]  Hongbin Yu,et al.  Improved High Frequency Response and Quality Factor of On-Chip Ferromagnetic Thin Film Inductors by Laminating and Patterning Co-Zr-Ta-B Films , 2013, IEEE Transactions on Magnetics.