The heterogeneous integration of single-walled carbon nanotubes onto complementary metal oxide semiconductor circuitry for sensing applications

A simple methodology for integrating single-walled carbon nanotubes (SWNTs) onto complementary metal oxide semiconductor (CMOS) circuitry is presented. The SWNTs were incorporated onto the CMOS chip as the feedback resistor of a two-stage Miller compensated operational amplifier utilizing dielectrophoretic assembly. The measured electrical properties from the integrated SWNTs yield ohmic behavior with a two-terminal resistance of approximately 37.5 kOmega and the measured small signal ac gain (-2) from the inverting amplifier confirmed successful integration of carbon nanotubes onto the CMOS circuitry. Furthermore, the temperature response of the SWNTs integrated onto CMOS circuitry has been measured and had a thermal coefficient of resistance (TCR) of -0.4% degrees C(-1). This methodology, demonstrated for the integration of SWNTs onto CMOS technology, is versatile, high yield and paves the way for the realization of novel miniature carbon-nanotube-based sensor systems.

[1]  C. Lieber,et al.  Nanowire Nanosensors for Highly Sensitive and Selective Detection of Biological and Chemical Species , 2001, Science.

[2]  O. Velev,et al.  Dielectrophoretic Assembly of Electrically Functional Microwires from Nanoparticle Suspensions , 2001, Science.

[3]  H. Stone,et al.  Dip coating for the alignment of carbon nanotubes on curved surfaces , 2004 .

[4]  H. A. Pohl,et al.  Dielectrophoresis: The Behavior of Neutral Matter in Nonuniform Electric Fields , 1978 .

[5]  Shinobu Fujita,et al.  A 1 GHz integrated circuit with carbon nanotube interconnects and silicon transistors. , 2008, Nano letters.

[6]  Kong,et al.  Nanotube molecular wires as chemical sensors , 2000, Science.

[7]  M. Dokmeci,et al.  Three dimensional controlled assembly of gold nanoparticles using a micromachined platform , 2007 .

[8]  Jeung-Soo Huh,et al.  Behavior of single-walled carbon nanotube-based gas sensors at various temperatures of treatment and operation , 2006 .

[9]  Wen Jung Li,et al.  Development of an automated microspotting system for rapid dielectrophoretic fabrication of bundled carbon nanotube sensors , 2006, IEEE Transactions on Automation Science and Engineering.

[10]  W.J. Li,et al.  Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors , 2004, IEEE Transactions on Nanotechnology.

[11]  Behzad Razavi,et al.  Design of Analog CMOS Integrated Circuits , 1999 .

[12]  Mechanical and electrical evaluation of parylene-C encapsulated carbon nanotube networks on a flexible substrate , 2008 .

[13]  Chih-Ming Ho,et al.  A micromachined flow shear-stress sensor based on thermal transfer principles , 1999 .

[14]  Joondong Kim,et al.  Inkjet printing of single-walled carbon nanotubes and electrical characterization of the line pattern , 2008, Nanotechnology.

[15]  H Morgan,et al.  Manipulation and trapping of sub-micron bioparticles using dielectrophoresis. , 1997, Journal of biochemical and biophysical methods.

[16]  Rosa H. M. Chan,et al.  Rapid assembly of carbon nanotubes for nanosensing by dielectrophoretic force , 2004 .

[17]  D. Physics,et al.  Nanotransfer printing of organic and carbon nanotube thin-film transistors on plastic substrates , 2005, cond-mat/0503463.

[18]  Mario Dagenais,et al.  Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL's) , 1999 .