A novel 3D thermal impedance model for high power modules considering multi-layer thermal coupling and different heating/cooling conditions
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[1] L. Dupont,et al. Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters , 2012, 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC).
[2] L. Dupont,et al. Comparison of Junction Temperature Evaluations in a Power IGBT Module Using an IR Camera and Three Thermosensitive Electrical Parameters , 2013, IEEE Transactions on Industry Applications.
[3] A. Bejan,et al. Heat transfer handbook , 2003 .
[4] G. G. Stokes. "J." , 1890, The New Yale Book of Quotations.
[5] Computationally Efficient Integration of Complex Thernal Multi-Chip Power Module Models into Circuit Simulators , 2007, 2007 Power Conversion Conference - Nagoya.
[6] Lei Wang,et al. An improved way to measure thermal impedance of insulated gate bipolar transistor (IGBT) module for power electronic packaging , 2013, 2013 14th International Conference on Electronic Packaging Technology.
[7] F. Blaabjerg,et al. Loss and thermal model for power semiconductors including device rating information , 2014, 2014 International Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE ASIA).
[8] U. Drofenik,et al. New physical model for lifetime estimation of power modules , 2010, The 2010 International Power Electronics Conference - ECCE ASIA -.
[9] Janusz Zarebski,et al. Modeling the Influence of Selected Factors on Thermal Resistance of Semiconductor Devices , 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[10] Frede Blaabjerg,et al. Lifetime estimation for the power semiconductors considering mission profiles in wind power converter , 2013, 2013 IEEE Energy Conversion Congress and Exposition.
[11] M. Liserre,et al. Toward Reliable Power Electronics: Challenges, Design Tools, and Opportunities , 2013, IEEE Industrial Electronics Magazine.
[12] Zhaohui Luo,et al. A thermal model for insulated gate bipolar transistor module , 2004, IEEE Transactions on Power Electronics.
[13] A. Hambrecht,et al. Lifetime Evaluation of IGBT Power Modules Applying a Nonlinear Saturation Voltage Observer , 2012, 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).
[14] Noel Y. A. Shammas,et al. Present problems of power module packaging technology , 2003, Microelectron. Reliab..
[16] F. Blaabjerg,et al. Thermal impedance model of high power IGBT modules considering heat coupling effects , 2014, 2014 International Power Electronics and Application Conference and Exposition.
[17] Frede Blaabjerg,et al. Loss comparison of different nine-switch and twelve-switch energy conversion systems , 2014, 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014.
[18] Ferenc Ender,et al. Thermal characterization of multichip structures , 2013, 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
[19] F. Blaabjerg,et al. Power electronics as efficient interface in dispersed power generation systems , 2004, IEEE Transactions on Power Electronics.
[20] Frede Blaabjerg,et al. Comparison between 9-level hybrid asymmetric and conventional multi-level inverters for medium voltage application , 2013, 2013 IEEE International Symposium on Industrial Electronics.
[21] Kaushik Rajashekara,et al. Power Electronics and Motor Drives in Electric, Hybrid Electric, and Plug-In Hybrid Electric Vehicles , 2008, IEEE Transactions on Industrial Electronics.