0.61W/mm2 resonant inductively coupled power transfer for 3D-ICs

A high power density wireless inductive power link targeting 3D-ICs and wireless testing is implemented in 65nm CMOS. Its operating frequency is 3.5GHz, the optimal frequency from the trade-off between delivered power and power loss. The link exploits high-Q inductors and resonant inductive coupling to boost the received voltage and maximize the delivered power. A power density of 0.61W/mm2 is achieved with 0.12×0.12mm2 coils and a 50μm separation.

[1]  Ishikuro Hiroki,et al.  A 0.14pJ/b Inductive-Coupling Transceiver , 2007 .

[2]  Young-Hyun Jun,et al.  8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology , 2009, IEEE Journal of Solid-State Circuits.

[3]  Sangwook Han,et al.  Wireless power transfer using resonant inductive coupling for 3D integrated ICs , 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

[4]  Tadahiro Kuroda,et al.  Simultaneous 6Gb/s data and 10mW power transmission using nested clover coils for non-contact memory card , 2010, 2010 Symposium on VLSI Circuits.

[5]  Tadahiro Kuroda,et al.  6W/25mm2 inductive power transfer for non-contact wafer-level testing , 2011, 2011 IEEE International Solid-State Circuits Conference.

[6]  T. Sakurai,et al.  A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link , 2007, IEEE Journal of Solid-State Circuits.

[7]  Tadahiro Kuroda,et al.  A 0.14pJ/b Inductive-Coupling Inter-Chip Data Transceiver with Digitally-Controlled Precise Pulse Shaping , 2007, 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers.

[8]  Hiroshi Kawaguchi,et al.  Chip-to-Chip Inductive Wireless Power Transmission System for SiP Applications , 2006, IEEE Custom Integrated Circuits Conference 2006.

[9]  Martin Fischer,et al.  Fully integrated passive UHF RFID transponder IC with 16.7-μW minimum RF input power , 2003, IEEE J. Solid State Circuits.

[10]  Tadahiro Kuroda,et al.  Digital rosetta stone: A sealed permanent memory with inductive-coupling power and data link , 2009, 2009 Symposium on VLSI Circuits.