Effect of surface treatments on interfacial adhesion energy between UV-curable resist and glass wafer

Abstract The interfacial adhesion energy between the resist and the substrate is very important in nanoimprinting because of problems with the resist sticking or pulling off during separation of the mold from the substrate. Substrate surface treatments with a self-assembled monolayer or oxygen plasma provide good adhesion between a resist coating and a silica substrate. In this paper, we describe the adhesion properties of a resist and a glass wafer measured using the four-point bending test. The interfacial adhesion energy between the resist and the glass wafer was evaluated for various substrate surface treatments of adhesion promoters and anti-sticking layers. The interfacial fracture energy without treatment was 1.23 J/m 2 , and was in the range 0.49–2.57 J/m 2 for the other treatments tested. The interfacial fracture surfaces were also investigated by field emission scanning electron microscopy, energy dispersive spectroscopy, and X-ray photoelectron spectroscopy to determine the fracture mode at the interfaces.

[1]  Eung-Sug Lee,et al.  Measurement of surface adhesion force of adhesion promoter and release layer for UV-nanoimprint lithography. , 2009, Journal of nanoscience and nanotechnology.

[2]  R. Cook,et al.  Four-point bend adhesion measurements of copper and permalloy systems , 2004 .

[3]  Stephen Y. Chou,et al.  Imprint of sub-25 nm vias and trenches in polymers , 1995 .

[4]  D. Choi,et al.  The Surface Treatment Effect for Nanoimprint Lithography using Vapor Deposition of Silane Coupling Agent , 2007 .

[5]  Y. Hirai,et al.  Multi-layered resist process in nanoimprint lithography for high aspect ratio pattern , 2006 .

[6]  Sanboh Lee,et al.  Analyses of mechanical failure in nanoimprint processes , 2006 .

[7]  A. Evans,et al.  A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces , 1989 .

[8]  Frances A. Houle,et al.  Adhesion between template materials and UV-cured nanoimprint resists , 2007 .

[9]  Eung-Sug Lee,et al.  Measurement of Adhesion Force by a Symmetric AFM Probe for Nano-imprint Lithography Application , 2008 .

[10]  David Peyrade,et al.  AFM characterization of anti-sticking layers used in nanoimprint , 2006 .

[11]  Zhigang Suo,et al.  Initiation and arrest of an interfacial crack in a four-point bend test , 2005 .

[12]  R. Shaviv,et al.  Optimizing the precision of the four-point bend test for the measurement of thin film adhesion , 2005 .

[13]  Dae-Geun Choi,et al.  Fluorinated organic-inorganic hybrid mold as a new stamp for nanoimprint and soft lithography. , 2005, Langmuir : the ACS journal of surfaces and colloids.