Die pickup unit and die bonder including the same

The die bonding apparatus includes a die pick-up unit to transport the die to the bonding on a wafer stage, and the pick-up of said die selectively to the pick-up die substrate for supporting a wafer divided into a plurality of dies . The die pick-up unit includes a first suction collet for the die being attached using a vacuum by using a magnetic force in the lower portion of the pick-up head with the pick-up head for picking up the feed to the die. Said first collet has a rectangular shape, the pick-up head has a plate shape, the first to mount the with the first projection corresponding to the short side of the first collet, the first collet and the other second collet provided with a second projection corresponding to the short side of the second collet.