Dynamic Dielectric Protection For I/0 Circuits Fabricated In A 2.5V CMOS Technology Interfacing To A 3.3V LVTTL Bus

Introduction As gate oxide thickness is reduced in advanced low-voltage CMOS technologies, protecting the Ti0 circuits’ dielectrics from over-voltage conditions becomes necessary when interfacing to higher voltage buses [1]. 3.3V LVTTL compatible I/O circuits fabricated in a 2.5V CMOS technology are presented. Dynamic dielectric protection techniques are employed to prevent overstressing gate oxide in U 0 circuits of a 4Mb SRAM where undershootlovershoot peaks of -lVi 4.3V can occur before diode clamping begins [2].

[1]  T. W. Hughes,et al.  Properties of high-voltage stress generated traps in thin silicon oxide , 1996 .

[2]  W. W. Abadeer,et al.  Correlation between theory and data for mechanisms leading to dielectric breakdown , 1994, Proceedings of 1994 VLSI Technology Symposium.

[3]  J. Conner,et al.  A 350 MHz 3.3 V 4 Mb SRAM fabricated in a 0.3 /spl mu/m CMOS process , 1997, 1997 IEEE International Solids-State Circuits Conference. Digest of Technical Papers.