Thermal properties of polytetrafluoroethylene/Sr2Ce2Ti5O16 polymer/ceramic composites

National Institute of Interdisciplinary Sciences and Technology & Cochin University of Science and Technology.

[1]  J.J. Shea,et al.  Electronic packaging materials and their properties , 2001, IEEE Electrical Insulation Magazine.

[2]  Y. Agari,et al.  Estimation on thermal conductivities of filled polymers , 1986 .

[3]  R. W. Schwartz,et al.  Thermal properties of La0.5Sr0.5Co1−xNixO3−δ ceramics using photopyroelectric technique , 2003 .

[4]  Ching-Ping Wong,et al.  Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging , 1999 .

[5]  Yu‐Der Lee,et al.  The Effects of Filler Content and Size on the Properties of PTFE/SiO2 Composites , 2003 .

[6]  P. Supancic,et al.  Thermal Conductivity of Platelet‐Filled Polymer Composites , 2004 .

[7]  Susumu Nagai,et al.  Thermal conductivity of a polymer composite , 1993 .

[8]  Anthony J. Bur,et al.  Dielectric properties of polymers at microwave frequencies: a review , 1985 .

[9]  Katsuhito Yoshida,et al.  Thermal properties of diamond/copper composite material , 2004, Microelectron. Reliab..

[10]  H. Chan,et al.  Thermal diffusivity of lead titanate/polyvinylidene fluoride‐trifluoroethylene nanocomposites by the mirage method , 2002 .

[11]  D. P. Button,et al.  Ceramic-fiber—Polymer composites for electronic substrates , 1989 .

[12]  Hong Wang,et al.  Preparation and dielectric properties of bismuth-based dielectric/PTFE microwave composites , 2006 .

[13]  D. Chung Materials for thermal conduction , 2001 .

[14]  E. Brown,et al.  The properties of poly(tetrafluoroethylene) (PTFE) in tension , 2004 .

[15]  J. Throne,et al.  Methods for predicting the thermal conductivity of composite systems: A review , 1976 .

[16]  Xiao Hu,et al.  Thermal conductivity of polystyrene–aluminum nitride composite , 2002 .

[17]  Yong-Seog Kim,et al.  Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation , 1999 .

[18]  Duncan M. Price,et al.  Thermal conductivity of PTFE and PTFE composites , 2002 .

[19]  M. Marinelli,et al.  Simultaneous determination of specific heat, thermal conductivity and thermal diffusivity at low temperature via the photopyroelectric technique , 1990 .

[20]  Rao Tummala,et al.  Ceramic and Glass‐Ceramic Packaging in the 1990s , 1991 .

[21]  P. Mohanan,et al.  PTFE/Sr2Ce2Ti5O16 polymer ceramic composites for electronic packaging applications , 2007 .

[22]  M. Tanaka,et al.  Thermal conductivity of a polymer filled with particles in the wide range from low to super‐high volume content , 1990 .

[23]  J. Philip,et al.  Simultaneous determination of thermal conductivity and heat capacity near solid state phase transitions by a photopyroelectric technique , 2000 .

[24]  A. Shapiro,et al.  Towards model-based engineering of underfill materials: CTE modeling , 2001 .

[25]  Ce-Wen Nan,et al.  Inverse Problem for Composites with Imperfect Interface: Determination of Interfacial Thermal Resistance, Thermal Conductivity of Constituents, and Microstructural Parameters , 2002 .

[26]  J. D. Ford,et al.  Thermal conductivities of powder‐filled epoxy resins , 1993 .

[27]  D. A. Beck,et al.  Materials for Electronic Packaging , 1962 .

[28]  Donald J. Cleland,et al.  A new approach to modelling the effective thermal conductivity of heterogeneous materials , 2006 .

[29]  R. S. Raghava,et al.  Thermal expansion of organic and inorganic matrix composites - a review of theoretical and experimental studies , 1988 .

[30]  Masayoshi Ohashi,et al.  Spherical Aluminum Nitride Fillers for Heat‐Conducting Plastic Packages , 2005 .

[31]  L. Holliday,et al.  Review: The thermal expansion of composites based on polymers , 1973 .

[32]  D. Hasselman,et al.  Effective Thermal Conductivity of Composites with Interfacial Thermal Barrier Resistance , 1987 .

[33]  Dilek Kumlutaş,et al.  Thermal conductivity of particle filled polyethylene composite materials , 2003 .