Substrate carrier apparatus for a solar cell-sided electroplating

The present invention relates to a substrate carrier device for a solar cell-sided electroplating. A substrate carrier device 100 of the present invention, the opening (opening) has the form of an area by a plurality of first protruding support portion 140 and the plurality of second protruding support portion 150 is installed on the rim supporting the edge of the receiving target wafer manipulating the (a contact point of the wafer release) - from the wafer receiving area 105, are respectively installed on the left and right side of the wafer receiving areas while rotating in a fixed position, the clip opening (to form a wafer and the contact points) and the clip closed is installed on the clip mounting rod (106, 107, 108, 109) and a clip-rod mounted for, and the number of the first clip 160, the clip open and a clip closed position is determined by the rotation of the rod clip is mounted, claim is provided around the wafer receiving area 105 on the second surface, the is characterized in that it comprises a plurality of second clip 170 to pass through the hole 151 formed in the second protruding support portion 150. the