Integrated circuit quality and reliability

Overview. Part 1 Introduction to integrated circuit manufacturing processes: front-end IC fabrication operations back-end fabrication operations in-line process monitors and test structures. Part 2 Impact of new technologies: circuit design trends changing fabrication techniques packaging technology trends electrical testing of VLSICs and ASICs. Part 3 Contamination and manufacturing errors: contamination human contamination (people) IC processing contamination contamination control computer-based sources of error in design and test circuit design material issues. Part 4 Causes (sources) of IC failures: fabrication-related causes of defects packaging and assembly related causes of IC failures reliability improvement. Part 5 Introduction to screening: screening.