Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation
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Chenming Hu | S. Rzepka | Kaustav Banerjee | E. Meusel | C. Hu | K. Banerjee | S. Rzepka | E. Meusel
[1] Tokuo Kure,et al. Multilevel interconnection for half-micron ULSI's , 1989, Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference.
[2] Y. S. Touloukian. Thermophysical properties of matter , 1970 .
[3] Chenming Hu,et al. Projecting interconnect electromigration lifetime for arbitrary current waveforms , 1990 .
[4] Werner Weber,et al. Thermal conductivity measurements of thin silicon dioxide films in integrated circuits , 1996 .
[5] Chenming Hu,et al. High-current failure model for VLSI interconnects under short-pulse stress conditions , 1997, IEEE Electron Device Letters.
[6] C. Hu,et al. An electromigration failure model for interconnects under pulsed and bidirectional current stressing , 1994 .
[7] Werner Weber,et al. Thermal Conductivity of Thin Silicon Dioxide Films in Integrated Circuits , 1995, ESSDERC '95: Proceedings of the 25th European Solid State Device Research Conference.