Packaging and integration technologies for future high-frequency power supplies

This paper reviews data from the International Technology Roadmap for Semiconductors to establish where dc-dc converters are headed in the first decade of the new millennium. It focuses on the high performance computing (high current, fast response, high power density) and portable/handheld (low profile) sectors. Magnetics and power device packaging technologies needed to allow power supplies to move to operating frequencies in the 1-10 MHz region are discussed. It introduces the concept of magnetic components fully embedded (windings and core) in PCB and silicon offering low profile and low losses at high frequency. It also reviews developments in wirebond-free power packaging such as flip-chip assembly that offer low profile, reduced parasitics and increased thermal performance. Finally, consideration is given to the changes in the power electronics industry that may need to be addressed to enable these new technologies to play a strategic role.

[1]  P. Elenius,et al.  Solder bars-a novel flip chip application for high power devices , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[2]  Mark G. Allen,et al.  Low temperature fabrication and characterization of integrated packaging-compatible, ferrite-core magnetic devices , 1997, Proceedings of APEC 97 - Applied Power Electronics Conference.

[3]  Charles R. Sullivan,et al.  Design of microfabricated transformers and inductors for high-frequency power conversion , 1996 .

[4]  Alan Mathewson,et al.  Long term noise measurements and median time to failure test for the characterization of electromigration in metal lines , 1999 .

[5]  D. Borojevic,et al.  An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures , 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

[6]  M. Mino,et al.  Planar microtransformer with monolithically-integrated rectifier diodes for micro-switching converters , 1996 .

[7]  Y. Katayama,et al.  High-power-density MHz-switching monolithic DC-DC converter with thin-film inductor , 2000, 2000 IEEE 31st Annual Power Electronics Specialists Conference. Conference Proceedings (Cat. No.00CH37018).

[8]  Terence O'Donnell,et al.  Electrical performance of microtransformers for DC-DC converter applications , 2002 .

[9]  Charles R. Sullivan,et al.  Converter and inductor design for fast-response microprocessor power delivery , 2000, 2000 IEEE 31st Annual Power Electronics Specialists Conference. Conference Proceedings (Cat. No.00CH37018).

[10]  V. J. Thottuvelil,et al.  Where are power supplies headed? , 2000, APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058).

[11]  J. Weld,et al.  Integrated magnetic-semiconductor components , 1998, IWIPP Proceedings. IEEE International Workshop on Integrated Power Packaging (Cat. No.98EX203).

[12]  Seth R. Sanders,et al.  In-board magnetics processes , 1999, 30th Annual IEEE Power Electronics Specialists Conference. Record. (Cat. No.99CH36321).

[13]  Chong H. Ahn,et al.  A DC/DC boost converter toward fully on-chip integration using new micromachined planar inductors , 1999, 30th Annual IEEE Power Electronics Specialists Conference. Record. (Cat. No.99CH36321).

[14]  Eberhard Waffenschmidt,et al.  Embedded passives integrated circuits for power converters , 2002, 2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference. Proceedings (Cat. No.02CH37289).

[15]  C. Gillot,et al.  Double-sided cooling for high power IGBT modules using flip chip technology , 2001 .

[16]  X. Liu,et al.  D/sup 2/BGA chip-scale IGBT package , 2001, APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181).

[17]  Martin A. M. Gijs,et al.  High inductance planar transformers , 2000 .

[18]  C. Schaeffer,et al.  Double-sided cooling for high power IGBT modules using flip chip technology , 2000, Conference Record of the 2000 IEEE Industry Applications Conference. Thirty-Fifth IAS Annual Meeting and World Conference on Industrial Applications of Electrical Energy (Cat. No.00CH37129).

[19]  S.C.O. Mathuna,et al.  Thick photoresist development for the fabrication of high aspect ratio magnetic coils , 2002 .

[20]  Terence O'Donnell,et al.  Electrical performance of micro-transformers for DC-DC converter applications , 2002 .

[21]  J.D. Van Wyk,et al.  Power electronics technology at the dawn of the new millenium-status and future , 1999, 30th Annual IEEE Power Electronics Specialists Conference. Record. (Cat. No.99CH36321).

[22]  Guo-Quan Lu,et al.  D2BGA Chip-Scale IGBT Package , 2001 .

[23]  C.O. Mathuna,et al.  PCB integrated inductors for low power DC/DC converter , 2002, APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335).

[24]  S. S. Wen,et al.  Dimple-array interconnect technique for packaging power semiconductor devices and modules , 2001, Proceedings of the 13th International Symposium on Power Semiconductor Devices & ICs. IPSD '01 (IEEE Cat. No.01CH37216).