Failure Prediction & Mitigation of Electronic Component in Automotive Controller during Transient Dynamic Event
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[1] Ching-Ping Wong,et al. Study on underfill/solder adhesion in flip-chip encapsulation , 2002 .
[2] Milena Vujosevic,et al. Accessing adhesive induced risk for BGAs in temperature cycling , 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
[3] P. Towashiraporn,et al. The effect of pcb flexural modes on dynamic reliability of ball grid array packages , 2008, 2008 58th Electronic Components and Technology Conference.
[4] Ee Hua Wong,et al. Board Level Drop Impact—Fundamental and Parametric Analysis , 2005 .
[5] Yi-Shao Lai,et al. Insights into correlation between board-level drop reliability and package-level ball impact test , 2006, 56th Electronic Components and Technology Conference 2006.
[6] Jason Wang Huijun,et al. MODELLING SOLDER JOINT RELIABILITY OF BGA PACKAGES SUBJECT TO DROP IMPACT LOADING USING SUBMODELLING , 2002 .
[7] E. Suhir. Is the maximum acceleration an adequate criterion of the dynamic strength of a structural element in an electronic product , 1997 .
[8] E. Bradley,et al. Relationship of tensile interfacial strength to lead-free BGA impact performance , 2006, 56th Electronic Components and Technology Conference 2006.
[9] A. McAllister,et al. Effects of Glue on the Bend Performance of Flip Chip Packages , 2008, IEEE Transactions on Components and Packaging Technologies.
[10] Dhananjay Panchagade. Damage Prediction of Lead Free Ball Grid Array Packages Under Shock and Drop Environment , 2007 .