High power led package and fabrication method thereof

The present invention provides a method of producing high power LED package with them. The present invention is a light emitting portion that generates light when power is applied, the light-emitting portion for fixing to the radiator mounted on the upper face, the lid part and integrally the heat radiation part and a lid part for electrically connecting between the light emitting portion and the substrate in the LED package including a mold, the heat-dissipating portion is stacked in at least two or more metal layers in the height direction, the lead portion at least is separated from the at least one first lead and the heat dissipating part that is extending from the external surface of the heat radiating portion It comprises one of the second leads. According to the high power LED package of the present invention, it is possible to unify the two parts into a single part to reduce the number of component parts, saving the manufacturing costs by simplifying the assembly process. LED, a package, a semiconductor element, a radiator, a metal layer, the mold unit, a lens, a filler