전자교환시스템 냉각을 위한 히트파이프 적용 연구

In the present study, the cooling package using the heat pipe has been developed to improve the thermal performance in the point of cooling characteristics of the electronic chip placed to the sub rack being readily assembled and disassembled in ATM switching system. As the preliminary experiments, the cooling performances between a conventional way using a cooling fin and a proposed method applying the heat pipe are compared and analyzed. The cooling performance at a simulated electronic component packaging a heat pipe module is approximately achieved up to 5.0W/㎠ heat flux and the allowable temperature at the heated chip is sustained in the range within 70℃. From the results, it was confirmed that temperature oscillations were also settled by inserted wick in the evaporator section. From the user's viewpoint, the method to assemble and disassemble the heat pipe easily has been devised.