Confirming electrical connection defects

An improved circuit board inspection system (200) incorporates a technique that confirms observed electrical connection defects. The improved circuit board inspection system (200) applies a localized investigative routine (1000) upon portions of a printed circuit board (210) having one or more identified defects. The technique accounts for the slope of a portion under test (800) of the printed circuit board (210) and provides results that are more accurate from inspection systems that report electrical connection defects.