Confirming electrical connection defects
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An improved circuit board inspection system (200) incorporates a technique that confirms observed electrical connection defects. The improved circuit board inspection system (200) applies a localized investigative routine (1000) upon portions of a printed circuit board (210) having one or more identified defects. The technique accounts for the slope of a portion under test (800) of the printed circuit board (210) and provides results that are more accurate from inspection systems that report electrical connection defects.