Accelerated life performance of moisture damaged plastic surface mount devices
暂无分享,去创建一个
[1] T. Steiner,et al. Investigations of Large PLCC Package Cracking During Surface Mount Exposure , 1987 .
[2] Norio Okabe,et al. Improvement of moisture resistance in plastic encapsulated MOS-IC by surface finishing copper leadframe , 1989, Proceedings., 39th Electronic Components Conference.
[3] Kunihiko Nishi,et al. Analysis of package cracking during reflow soldering process , 1988, 26th Annual Proceedings Reliability Physics Symposium 1988.
[4] The impact of delamination on stress-induced and contamination-related failure in surface mount ICs , 1992, 30th Annual Proceedings Reliability Physics 1992.
[5] E. Blackshear,et al. Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow process , 1988 .
[6] R. L. Shook. Moisture sensitivity characterization of plastic surface mount devices using scanning acoustic microscopy , 1992, 30th Annual Proceedings Reliability Physics 1992.
[7] T. M. Moore,et al. Correlation of surface mount plastic package reliability testing to nondestructive inspection by scanning acoustic microscopy , 1991, 29th Annual Proceedings Reliability Physics 1991.
[8] I. Fukuzawa,et al. Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering , 1985, 23rd International Reliability Physics Symposium.