Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces

We observed various EM-induced failures in current-stressed Cu/Sn/Cu flip-chip solder joints. EM-induced Cu-pad consumption occurred at the current-entry point (maximum current-density) on the cathode interface, and voiding occurred at the other joint corner away from the current-entry point (minimum current-density). We believe that the above various EM-induced failure modes were the result of different current-stressing densities and joule heating at the cathode joint interfaces.

[1]  Y. C. Chuang,et al.  Study of electromigration-induced Cu consumption in the flip-chip Sn∕Cu solder bumps , 2006 .

[2]  S. Wang,et al.  Electromigration studies on Sn(Cu) alloy lines , 2003, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

[3]  Y. C. Chuang,et al.  Electromigration-induced Kirkendall voids at the Cu∕Cu3Sn interface in flip-chip Cu∕Sn∕Cu joints , 2007 .

[4]  I. Ames,et al.  Reduction of electromigration in aluminum films by copper doping , 1970 .

[5]  Shui-Jinn Wang,et al.  Current density dependence of electromigration-induced flip-chip Cu pad consumption , 2006 .

[6]  D. R. Frear,et al.  Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization , 2001 .

[7]  King-Ning Tu,et al.  Electromigration failure in flip chip solder joints due to rapid dissolution of copper , 2003 .

[8]  C. Kao,et al.  Interfacial reaction issues for lead-free electronic solders , 2006 .

[9]  Dong Ma,et al.  Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow , 2002 .

[10]  King-Ning Tu,et al.  Electromigration in Sn-Pb solder strips as a function of alloy composition , 2000 .

[11]  Y. L. Lin,et al.  Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints , 2006 .

[12]  Kazuaki Ano,et al.  Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability , 2005 .

[13]  D. R. Frear,et al.  Electromigration of eutectic SnPb solder interconnects for flip chip technology , 2001 .

[14]  Remo Guidieri.  Res , 1995, RES: Anthropology and Aesthetics.

[15]  Andrew G. Glen,et al.  APPL , 2001 .

[16]  King-Ning Tu,et al.  Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples , 2005 .